High Performance Computing

  • Higher Processor Speed and more Cores
  • Optimized Cooling Efficiency
  • Absolutely Stable Operation under up to Rough Conditions

A higher number of processor cores, increasing clock rates and ever smaller production technology - all accompanied by smaller CPU-DIE interfaces - present manufacturers of high-performance embedded systems with acute challenges. New technologies and materials are needed to provide efficient advantageous package integration for the deployment of such systems under harsh conditions.