Features
| CPU: | Intel® ATOM™ Z500 Processor (Silverthorne) |
| CPU Choice: | Z510, Z530 |
| Chipset: | Intel® US15W (Poulsbo) |
| onboard Connectors | |
| RAM: | Up to 2GB DDR2 533MHz |
| LAN: | 1x GbLAN Intel 82574L |
| Graphic: | VGA/LVDS (18/24bit) |
| USB: | 7x USB 2.0 (Host) plus 1x USB 2.0 (Device) |
| COM: | 2x COM RS232 plus 1x LPT |
| ISA: | 1x PC/104 (16bit ISA) |
| PCI: | 1x PC/104-plus (PCI) |
| PCI-Express: | no additional PCIe/104 |
| Storage: | 1x PATA 44 Pin (Master or Slave) |
| Storage: | 1x PATA SSD (2-32GB) (Master or Slave) |
| PCIe Expansion: | no additional PCIe Expansion |
| Audio: | 1x Audio AC97 |
| GPIO: | no additional GPIO |
| TPM: | no additional TPM |
| Temp Std.: | -20° to +70°C |
| Temp Ext.: | -40° to +85°C (option upon request) |
| PSU DC Input: | Single Rail 5V |
| SBC Formfactor | PC/104-Plus |
| PCIe/104 Typ: | no PCIe/104 Typ |
| Dimension: | 90 mm x 96 mm (3.5" x 3.8") |
| Weight: | 96gr |
Description
The ADLS15PC PC/104-Plus is based on the Intel® Atom™ and the Intel® US15W (Poulsbo™) chipset. The Intel® Atom™ is a single core processor built on a 45nm process that boasts an impressive 2.64 watts TDP. The Intel® Atom™ delivers the benefits of genuine Intel® architecture to small form factor and thermally constrained markets. The Intel® US15W System Controller Hub (SCH) incorporates all functions of legacy GMCH and ICH architectures into a single die.
The ADLS15PC takes advantage of these features by delivering high performance and low thermals in a compact PC/104-Plus form factor. The Intel® graphics controller drives a CRT to 1600x1200@60Hz and/or 18/24 bit LVDS LCD. Memory is added via an SODIMM200 socket that will accept up to 2GB of DDR2-400/533 DRAM. In addition to ACPI/APM functions, EIDE, 8xUSB 2.0, 2xRS232 COM ports, PS/2 Keyboard and Mouse, LPT, AC97 Sound, 10/100/1000MBit LAN and more, the ADLS15PC also comes equipped with up to 4GB onboard SSD. Driver sets for Windows operating systems, as well as BSP’s for Windows® CE6 and VxWorks® are available.
ADL Embedded Solutions offer very effective active and passive thermal solutions designed for this product.
Please contact your sales representative for more information
sales@adl-europe.com
Ordering Information
| Item Codes | Part# | Description |
|---|---|---|
| CPU-Boards | ||
| ADLS15PC-110 | 292310 | Atom Z510 1.1GHz, no on Board flash |
| ADLS15PC-112 | 292312 | Atom Z510 1.1GHz w/2GB on Board flash |
| ADLS15PC-114 | 292314 | Atom Z510 1.1GHz w/4GB on Board flash |
| ADLS15PC-118 | 292318 | Atom Z510 1.1GHz w/8GB on Board flash |
| ADLS15PC-160 | 292360 | Atom Z530 1.6GHz, no on Board flash |
| ADLS15PC-162 | 292362 | Atom Z530 1.6GHz w/2GB on Board flash |
| ADLS15PC-164 | 292364 | Atom Z530 1.6GHz w/4GB on Board flash |
| ADLS15PC-168 | 292368 | Atom Z530 1.6GHz w/8GB on Board flash |
| Memories | ||
| DDR2-DRAM1024-(V) | 996050 | 1GB DDR2 DRAM 667MHZ (V) |
| DDR2-DRAM2048-(V) | 996150 | 2GB DDR2 DRAM 667MHZ (V) |
| DDR2-DRAM1024-EX-(V) | 996051 | 1GB DDR2 DRAM-EX 667MHZ (V) -40°C TO +85°C |
| DDR2-DRAM2048-EX-(V) | 996151 | 2GB DDR2 DRAM-EX 667MHZ (V) -40°C TO +85°C |
| Thermal solutions | ||
| ADLS15PC-FANSINK | 292063 | heat sink and fan assembly for ADLS15PC |
| ADLS15PC-PASSIVE LP | 292062 | low profil passiv heat sink |
| ADLS15PC-SP0600 | 292061 | 0.6" heat spreader for chassis mount, suggest QTY 4 293406 |
| ADLS15PC-SP1000 | 292064 | 1.0" heat spreader for chassis mount, suggest QTY 4 91075A107 |
| CS-100 | 290010 | 10"x10" thermal chassis simulator for development |
| Cables & Accessoires | ||
| ADLS15PC-CK | 293047 | Development cable kit for ADLS15PC |
| STANDOFF-MSS | 293406 | .6" (15.24mm) PC/104 M3, QTY 1 precision milled SS stand-off/post |
| STANDOFF-1"M3 | 293436 | 1" PC/104 M3, QTY 1 precision milled SS stand-off/post |
| ADLLVDSTTL | 299915 | LVDS to TTl converter board for ADL CPU'S (not in stack) |
| ADLCF-II-D | 989020 | compact flash to IDE type II dual adapter |
| ADLCF-II-S | 989010 | compact flash to IDE type II single adapter |
| Options | ||
| ADL-ET | 290000 | Extended Temperature Screening (–40C to +85C) |
| UNDERFILL | 807707 | BGA underfill req’d for <1nm BGA solderballs w/ Ext Temp |
| COATING | 807706 | Conformal Coating |
| UNDERFILL/BONDING/COATING | 807709 | Underfilling, Bonding, and Conformal Coating |
| Software | ||
| Driver | Click here | |
| ADLSST | Not available |