Features

CPU: Intel® Core™ Celeron/I5/I7/Xeon Processor (Skylake and Kaby Lake)
CPU Choice:

Celeron G3900TE, i5-6500TE, i7-6700TE, Xeon E3-1268L v5 (Socket LGA1151) Celeron G3930TE, i5-7500T, i7-7700T

Chipset: Intel® Q170 Sunrise Point
RAM: Up to 32GB DDR4L-2133 SoDIMM
 Frontpanal-Connectors
LAN: 2x GbLAN Intel i210/i219
Graphic: DVI 1920x1080 @ 60Hz 24bpp; Supports VGA/CRT
USB: USB 4x 3.0
COM: 1x COM RS232
PSU Input: PSU not onboard, external option ADLPS35ISO
 Internal-Connectors (SBC onboard)
LAN: No additional LAN onboard
Graphic: 1x DVI/HDMI/DP via I-PEX Option
USB: 1x USB3.0 via I-PEX Option
Storage: 4x SATA (6Gb/s) (RAID 0/1/5/10)
Storage: No additional Storage
Serial COM: 1x TTL (RX/TX only) within the Power-Input Connector
Audio: 1x HD Audio (DP/HDMI)
I/O Expansion: No additional I/O Expansion
PCIe Expansion: 1x 2x40 pin PCIe (1x4/4x1)
GPIO: 1x GPIO (8) via FCI Option
Security: 1x TPM 2.0 (solder option upon request)
Temp Std.: -20° to +70°C
Temp Ext.: -40° to +85°C (option upon request)
PSU DC Input: ATX requierment 5V, 5VSB, 3V (12V optional for PCIe or FAN)
PSU Features: S-UPS (option upon request)
SBC Formfactor 3.5"-SBC
Dimension: 102mm x 147mm (4" x 5.8")
Weight: 232gr

Description

The ADLQ170HDS features Intel's 6th and 7th generation Intel Core™ processors with Intel's Q170 PCH (Sunrise Point) and latest iGPU HD Graphics 500 / 600 engine. The iGPU supports DirectX12.1, OpenGL 4.4, and Intel Quicksync. The Skylake Architecture built on Intel's low-power 14nm tri-gate process incorporates the new AVX2.0 instruction set, more instructions per cycle, deeper idle states, more execution units, higher cache bandwidth, and smarter power management with the end result being a significant performance increase with much lower power than the previous Haswell architecture. The actual new Kaby Lake is the architecture Refresh of Skylake. With the new iGPU HD 600 series Intel Kaby Lake products support HEVC/4K H.256 Hardware En-/Decoding as well as VP9 Decode trough hardware.

The ADLQ170HDS is ideal for mobile and embedded applications where high processor performance with low battery or power usage is critical. It brings  unparalleled performance to applications such as radar and sonar processing, image signal processing, tactical command and control, surveillance and reconnaissance, medical images lab analysis, and industrial automation.

In addition to the wide range of applications in which the ADLQ170HDS can excel, it also supports a broad set of features. The ADLQ170HDS introduces TPM 2.0 as a option and DDR4 Memory functionality into ADL 3.5" SBC product line for the first time. The memory can be installed into 2 SoDimm DIMM socket with a max of 16GB each. Onboard connectors support both DVI/VGA as well as HDMI/DP by IPEX. The ADLQ170HDS also has 1x RS232 COM port, 4x SATA 6Gb/s with RAID 0, 1, 5 and 10 support. It also includes 6x USB2.0, 5x USB 3.0, two bootable Gigabit Ethernet LAN ports, HD Audio 7.1, and a expansion connector 2x40-pin PCIe (Gen. 3.0) with four PCIe x1 lanes or one PCIe x4 lane to expand I/O functionality. ADL Embedded Solutions offers highly effective thermal solutions for different use cases.

Please contact your sales representative for more information
sales@adl-europe.com

Ordering Information

Item Codes Part# Description
CPU-Board    
ADLQ170HDS tbd. 6. / 7. Generation Intel Core SBC 3,5" (without CPU)
CPU-Options    
Intel i7-7700T tbd. Intel® Core™ i7-7700TE Processor (8M Cache, up to 3.80 GHz)
Intel i5-7500T tbd. Intel® Core™ i5-7500TE Processor (6M Cache, up to 3.30 GHz)
Intel G3930TE tbd. Intel® Celeron® Processor G3930TE (2M Cache, 2.70 GHz), Intel® HD Graphics 610
Intel Xeon E3-1268L tbd. Intel® Xeon™ E3-1268L v5 Processor (8M Cache, up to 3.40 GHz)
Intel i7-6700TE tbd. Intel® Core™ i7-6700TE Processor (8M Cache, up to 3.40 GHz)
Intel i5-6500TE tbd. Intel® Core™ i5-6500TE Processor (6M Cache, up to 3.30 GHz)
Intel G3900TE tbd. Intel® Celeron® Processor G3900TE (2M Cache, 2.30 GHz), Intel® HD Graphics 510
Memories    
DDR4-DRAM4096 tbd. 4GB DDR4 DRAM 2133MHZ
DDR4-DRAM8192 tbd. 8GB DDR4 DRAM 2133MHZ
DDR4-DRAM16384 tbd. 16GB DDR4 DRAM 2133MHZ
DDR4-DRAM4096EX tbd. 4GB DDR4 DRAM-EX 2133MHZ -40°C TO +85°C
DDR4-DRAM8192EX tbd. 8GB DDR4 DRAM-EX 2133MHZ -40°C TO +85°C
DDR4-DRAM16384EX tbd. 16GB DDR4 DRAM-EX 2133MHZ -40°C TO +85°C
Thermal solutions    
ADLQ170HDS-SPREADER tbd. heat spreader for chassis mount ADLQ170HDS
ADL35-BBHS 294152 large heat sink for ADLXXXHD CPU's
ADL35-LFAN 294154 large fan for ADL35-BBHS
ADL35-SOSET 294156 stand off set for ADL35-BBHS & LFAN
CS-100 290010 10"x10" thermal chassis simulator for development
Options    
ADL-ET 290000 Extended Temperature Screening (–40C to +85C)
UNDERFILL 807707 BGA underfill req’d for <1nm BGA solderballs w/ Ext Temp
COATING 807706 Conformal Coating
UNDERFILL/BONDING/COATING 807709 Underfilling, Bonding, and Conformal Coating
Software    
Driver   Click here
ADLSST   Not yet available