Features

CPU: Intel® Atom™ E3900 Processor (Apollo Lake)
CPU Choice: Quad Core (x5-E3940), Dual Core (x5-E3930)
Chipset: Intel® SoC
RAM: Up to 8GB LPDDR4 soldered
Frontpanal-Connectors
LAN: 2x GbLAN (Intel)
Graphic: DisplayPort 2K/4K (Supports DVI/HDMI)
USB: USB 2x 3.0
COM: No external COM
PSU Input: PSU onboard (galvanic isolated) wide range DC input
Internal-Connectors (SBC onboard)
LAN: No additional LAN
Graphic: No additional Graphic
USB: 2x USB 2.0 by BA Edge-Connect (muliplexed with SATA and PCIe)
Storage: 2x SATA 6Gb/s by BA Edge-Connect (muliplexed with USB and PCIe)
Storage: 1x SATA Storage Expansion: M.2 Key-B 2242
Serial COM: No additional COM
Audio: 1x HD Audio (DP/HDMI)
I/O Expansion: No additional I/O
PCIe Expansion: 2x PCIe X1 2.0 by BA Edge-Connect (muliplexed with USB and SATA)
GPIO: No additional GPIO
TPM: fTPM 2.0
Temp Std.:  -20° to +70°C
Temp Ext.:  -40° to +85°C (option upon request)
PSU Input: Galvanic Isolated, Single Voltage, Wide Range 20-30VDC (24VDC Nominal) Optional 7-36VDC
PSU Features: Optional: Beckhoff OCT PSU Feature
   
Dimension: 75mm x 75mm (2.9" x 2.9")
Weight: approx. 60gr

 

Description

Measuring only 75 x 75mm, the CB6373 is the second generation embedded SBC optimized for size, weight and power (SWAP) applications. Based on the Intel Atom™ SoC E3900 series, this tiny board offers maximum performance in the smallest possible size. It features up to quad-core x86 processors with 2MB cache and an integrated Intel HD graphics 505 engine of the 9th generation with support for DirectX 12, Open GL 4.4, OpenCL 2.0 and hardware-accelerated UHD video playback with H.265/HEVC, VC-1, WMV9 and VP9.

About the Beckhoff Edge-Connect Architecture:

The rear edge connector provides easy access to additional I/Os for standard and custom breakout boards. This simple expansion helps to reduce cabling, integration time and system size, while increasing quality and overall MTBF. Connection to sensors, cameras and memories is easy with a variety of onboard I/Os: 2x Gigabit LAN, 1x USB 3.0, 1x USB 2.0, 2x PCie and SATA. The Intel HD graphics engine outputs video via the DisplayPort (optionally via adapter also HDMI/DVI). An integrated M.2 socket enables the user to install the fastest solid state storage solutions on the market. The fix mounted edge-connect design coupled with soldered-on memory makes the CB6373 ideal for rugged embedded applications in extended temperature range as well as shock and vibration.

ADL edge connect technology

Applications:

UAV and UUV Unmanned Systems, Industrial Control Systems, Government and Defense, Video Surveillance, Small Scale Robotics, Remote Datalogging, Man-Wearable Computing

Please contact your sales representative for more information:
sales@adl-europe.com

Ordering Information

Item Codes Part# Description
     
CPU-Boards    
CB6373 V1 tbd. Intel x5-E3930 Atom Processor; Dual Core, 2x 1.3 GHz, 2MB Cache, 6,5W TDP, 4GB RAM soldered
CB6373 V4 tbd Intel x5-E3940 Atom Processor; Quad Core, 4x 1.6 GHz, 2MB Cache, 9,5W TDP, 8GB RAM soldered
     
Thermal solutions    
CB6373-LP-Spreader tbd. Low-Profile Heat Spreader CB6373
     
Options    
ET-SCREENING 290000 Extended Temperature Screening (–40C to +85C)
UNDERFILL 807707 BGA underfill req’d for <1nm BGA solderballs w/ Ext Temp
COATING 807706 Conformal Coating
UNDERFILL/BONDING/COATING 807709 Underfilling, Bonding, and Conformal Coating