Features

CPU: Intel® Atom™ E3800 Processor (Bay Trail)
CPU Choice: Quad Core E3845, Dual Core E3827, Single Core E3815
Chipset: Intel® SoC
RAM: Up to 4GB DDR3L 1333MHz soldered
 Frontpanal-Connectors
LAN: 2x GbLAN Intel i210
Graphic: DP 1920x1080 @ 60Hz 24bpp; Supports DVI/HDMI
USB: USB 1x 2.0, 1x 3.0
COM: No external COM
PSU Input: PSU onboard wide range DC input
 Internal-Connectors (SBC onboard)
LAN: No additional LAN
Graphic: No additional Graphic
USB: No additional USB
Storage: No additional SATA-Connector
Storage: 1x SATA Storage Expansion: M.2 Key-B 2242
Serial COM: No additional COM
Audio: 1x HD Audio (DP/HDMI)
I/O Expansion: No additional I/O
PCIe Expansion: No additional PCIe
GPIO: No additional GPIO
TPM: no additional TPM
Temp Std.:  -20° to +70°C
Temp Ext.:  -40° to +85°C (option upon request)
PSU Input: Single Voltage, wide range 20-30VDC (24VDC Nominal) Optional 7-36VDC
PSU Features: No additional PSU Features
SBC Formfactor ADL-SEC
Dimension: 75mm x 75mm (2.9" x 2.9") 
Weight: 59gr

 

Description

Measuring just 75mm x 75mm, the ADLE3800SEC is an embedded SBC specially optimized for Size, Weight, and Power (SWAP) applications. Based on the E3800 series Intel Atom™ SoC, this tiny board delivers maximum performance in the smallest possible size. It features a quad-core processor with up to 2MB onboard cache, and an integrated Intel HD Graphics engine with support for DirectX 11, Open GL 4.0, and full HD video playback.

About Edge-Connect Architecture:

Via the backside board-edge connector, additional I/O can easily be made accessible using standard and customer-specific breakout boards. Provides easy expansion and helps reduce cabling, integration time and system size all while increasing quality and overall MTBF. Connecting to sensors, cameras and storage is easy with a full range of onboard I/O: 2x Gigabit LAN, 1x USB 3.0, 1x USB 2.0, 2x PCie, and SATA. The Intel HD Graphics engine supports video output in either HDMI or Display Port format. An onboard M.2 socket allows users to install the fastest Solid State storage solutions on the market. Extended Temperature Ratings and hard-mounted Edge-Connect design make the ADLE3800SEC ideal for rugged embedded applications.

ADL edge connect technology

Applications:

UAV and UUV Unmanned Systems, Industrial Control Systems, Government and Defense, Video Surveillance, Small Scale Robotics, Remote Datalogging, Man-Wearable Computing

Please contact your sales representative for more information
sales@adl-europe.com

Ordering Information

Item Codes Part# Description
CPU-Boards    
ADLE3800SEC-E3845-4 41515012 Intel E3845 Atom Processor; Quad Core, 4x 1.91 GHz, 2MB Cache, 9W TDP, 4GB RAM soldered
ADLE3800SEC-E3827-4 41515011 Intel E3827 Atom Processor; Dual Core, 2x 1.75GHz, 1MB Cache, 8W TDP, 4GB RAM soldered
ADLE3800SEC-E3815-2 41515010 Intel E3815 Atom Processor; Single Core, 1x 1.46GHz, 0,5MB Cache, 2,5W TDP, 2GB RAM soldered
Thermal solutions    
ADLE3800SEC-Spreader 48599023-SET Low-Profile Heat Spreader
Options    
ADL-ET 290000 Extended Temperature Screening (–40C to +85C)
UNDERFILL 807707 BGA underfill req’d for <1nm BGA solderballs w/ Ext Temp
COATING 807706 Conformal Coating
UNDERFILL/BONDING/COATING 807709 Underfilling, Bonding, and Conformal Coating
Software    
Driver   Click here
ADLSST   Click here