CPU: Intel® Celeron™-M, Pentium™M  (Dothan) 
CPU Choice: Celeron-M373CM, Pentium-M 745PM
Chipset: Intel® 855GME (Montara) ICH4
 onboard Connectors
RAM: Up to 1GB DDR 333MHz (Optional ECC)
LAN: 1x Fast Ethernet Intel 82551ER/82562EZ
Graphic: VGA/LVDS (18/24/36/48bit)
USB: 4x USB 2.0
COM: 2x COM RS232 plus 1x LPT
ISA: 1x PC/104 (16bit ISA)
PCI: 1x PC/104-plus (PCI) 
PCI-Express: no additional PCIe/104
Storage: 1x PATA 44 Pin (Master + Slave)
Storage: no additional Storage
PCIe Expansion: no additional PCIe Expansion
Audio: 1x Audio AC97
GPIO: no additional GPIO
TPM: no additional TPM
Temp Std.:  -20° to +70°C
Temp Ext.:  -40° to +85°C (option upon request)
PSU DC Input: Single Rail 5V
SBC Formfactor PC/104-Plus
PCIe/104 Typ: no PCIe/104 Typ
Dimension: 96mm x 115,5mm (3.8" x 4,5")
Weight: 112gr


The ADL855PC is based on the Intel® Pentium® M / Celeron® M processors offering clock rates up to 1.8GHz. The Intel® 855GME chipset (GMCH) supports a 400MHz FSB with integrated Intel® Graphics controller “Extreme Graphics 2“. It can drive either a CRT or LVDS LCD. The memory is added via an SODIMM200 socket and can accept up to 1Gigabyte of DDR333 SDRAM.

The ADL855PC power management incorporates ACPI/APM functions, which utilizes Intel's Advanced SpeedStep ® (Pentium ® M only) feature. The standard ADL855PC also incorporates PCI 2.2 Bus, EIDE, 4xUSB 2.0, 2xRS232 COM ports, PS/2 Keyboard and Mouse, parallel printer, AC97 Sound and 10/100MBit LAN and more.

ADL Embedded Solutions offer highly effective active and passive cooling solutions based on proven thermal data and mounting techniques; resulting in the least possible mechanical board stress. Please contact your Sales Engineer for detailed information on cooling solutions to fit your needs.

Note: On the basis of its current material planning, ADL Embedded Solutions guarantees product availability for the 855GME chipset, Pentium-M 745 1.8GHz and Celeron-M 373 1.0GHz processors through 2015 and beyond, thus providing sufficient time for customers to transition from the 16-bit ISA bus to newer interconnect technologies.

Please contact your sales representative for more information

Ordering Information

Item Codes Part# Description
ADL855PC-373-G5 292248 CELERON M 373 CPU, 1.0GHz, 512K CACHE
ADL855PC-745-G5 292245 PENTIUM M 745 CPU, 1.8GHz , 2M CACHE
DDR-DRAM256-(A) 994825 256MB DDR 333MHz STD TEMP
DDR-DRAM512-(A) 994925 512MB DDR 333MHz STD TEMP
Thermal solutions    
ADLTS2HSS 292054 2 piece heat sink set for ADL855/945PC
ADLTS2HSS-FAN 293057 fan for ADLTS2HSS thermal solution
ADLTS2PIPE 293054 heat pipe solution for ADL855/945PC
SPREADER-FANSINK SINGLE 292415M-SET Heatsink with single fan assembly for ADL855/945/GS45PC to be mounted on top of ADL SP0600/SP1000 typical bench- & development use only!
ADL855PC-SP0600 293152 0.6" heat spreader for chassis mount, suggest QTY 4 293406
ADL855PC-SP1000 293153 1.0" heat spreader for chassis mount, suggest QTY 4 91075A107
CS-100 290010 10"x10" thermal chassis simulator for development
Cables & Accessoires    
ADL855PC-CK 293045 Development cable kit for ADL855/LX8PC
STANDOFF-MSS 293406 .6" (15.24mm) PC/104 M3, QTY 1 precision milled SS stand-off/post
STANDOFF-1"M3 293436 1" PC/104 M3, QTY 1 precision milled SS stand-off/post
ADLLVDSTTL 299915 LVDS to TTl converter board for ADL CPU'S (not in stack)
ADLCF-II-D 989020 compact flash to IDE type II dual adapter
ADLCF-II-S 989010 compact flash to IDE type II single adapter
ADL-ET 290000 Extended Temperature Screening (–40C to +85C)
UNDERFILL 807707 BGA underfill req’d for <1nm BGA solderballs w/ Ext Temp
COATING 807706 Conformal Coating
UNDERFILL/BONDING/COATING 807709 Underfilling, Bonding, and Conformal Coating
Driver   Click here
ADLSST   Not available